Product Description:
QIMEI POLYLAC ® MABS resin is a copolymer mainly composed of methyl methacrylate, acrylonitrile, butadiene, and styrene as raw materials. It balances good transparency, processability, mechanical performance, and dimensional stability. In order to achieve excellent transparency, we strive to ensure that the refractive indices of ABS and rubber matrices remain consistent. MABS also has excellent impact resistance. This material can be used to manufacture computer peripherals, household electronic products, transparent toy parts, household appliances, medical equipment, food and drinking water containers, and cosmetic containers. POLYLAC ® MABS complies with RoHS, REACH SVHC, UL, and multiple international standards for various applications.
Product Description:
QIMEI POLYLAC ® MABS resin is a copolymer mainly composed of methyl methacrylate, acrylonitrile, butadiene, and styrene as raw materials. It balances good transparency, processability, mechanical performance, and dimensional stability. In order to achieve excellent transparency, we strive to ensure that the refractive indices of ABS and rubber matrices remain consistent. MABS also has excellent impact resistance. This material can be used to manufacture computer peripherals, household electronic products, transparent toy parts, household appliances, medical equipment, food and drinking water containers, and cosmetic containers. POLYLAC ® MABS complies with RoHS, REACH SVHC, UL, and multiple international standards for various applications.
| Material Technical Data Sheet | ||||
| ABS-03 PA-758 R transparent ABS | ||||
| characteristic | Application Area | |||
| Good surface | Electronic and Electrical Applications | |||
| Performance & dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| High temperature resistance | precise molding applications | |||
| dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| characteristic | Testing standards | Test conditions | Unit | Typical value |
| Physical Property | ||||
| proportion | ISO 1183 | 23℃ | g/cm³ | 1.08 |
| Mold Shrinkage | ISO 294-4 | % | 0.3~0.7 | |
| Melt Index | ISO 1133 | 200℃ X50KG | ml/10 min | 2.2 |
| Mechanical Property | ||||
| Mechanical Property | Testing standards | Test conditions | Unit | Data |
| tensile strength | ISO 527 | 50mm/min | mpa | 45 |
| Elongation rate | ISO 527 | 50mm/min | % | 45 |
| bending strength | ISO 178 | 2mm/min | MPA | 62 |
| Bending elastic modulus | ISO 178 | 2mm/min | GPA | 2.1 |
| IZOG impact strength with a gap | ISO 180/1A | 23℃ | KJ/㎡ | 15 |
| IZOG impact strength with a gap | ISO 180/1A | -30 | KJ/㎡ | 8 |
| Thermal Property | ||||
| Thermal Property | Testing standards | Test conditions | Unit | Data |
| Non-burning-out Heat distortion temperature | ISO 75/A | 1.8MPa | ℃ | 75 |
| burning-out Heat distortion temperature | ISO 75/A | 1.8MPa | ℃ | 95 |
| Electrical Property | ||||
| Electrical Property | Testing standards | Data | Unit | |
| Bulk Resistance | IEC 60695-11-10 | HB | Ω | |
| Insulation strength 1.5mm | IEC 60695-11-10 | HB75 | kv/mm | |
| Flame Retardancy | ||||
| Flame Retardancy | Testing standards | Data | ||
| Fire rating full-color 1.5mm | UL94 | V-2 | ||
| Fire rating full-color 3.0mm | UL94 | V-2 | ||
| Injection molding | ||||
| Injection molding | Unit | Data | ||
| drying temperature | ℃ | 85 | ||
| drying time | H | 3～5 | ||
| Front measuring area Temperature | ℃ | 250～220 | ||
| Mid compression zone Temperature | ℃ | 250～220 | ||
| Third section feeding zone Temperature | ℃ | 220～200 | ||
| Optimal ejection temperature | ℃ | 230~240 | ||
| Maximum melting temperature | ℃ | 250 | ||
| mold temperature | ℃ | 50～70 | ||
| injection speed | Medium low speed | |||
| Back pressure | 5～10 | KG/c㎡ | ||
| Material Technical Data Sheet | ||||
| ABS-03 PA-758 R transparent ABS | ||||
| characteristic | Application Area | |||
| Good surface | Electronic and Electrical Applications | |||
| Performance & dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| High temperature resistance | precise molding applications | |||
| dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| characteristic | Testing standards | Test conditions | Unit | Typical value |
| Physical Property | ||||
| proportion | ISO 1183 | 23℃ | g/cm³ | 1.08 |
| Mold Shrinkage | ISO 294-4 | % | 0.3~0.7 | |
| Melt Index | ISO 1133 | 200℃ X50KG | ml/10 min | 2.2 |
| Mechanical Property | ||||
| Mechanical Property | Testing standards | Test conditions | Unit | Data |
| tensile strength | ISO 527 | 50mm/min | mpa | 45 |
| Elongation rate | ISO 527 | 50mm/min | % | 45 |
| bending strength | ISO 178 | 2mm/min | MPA | 62 |
| Bending elastic modulus | ISO 178 | 2mm/min | GPA | 2.1 |
| IZOG impact strength with a gap | ISO 180/1A | 23℃ | KJ/㎡ | 15 |
| IZOG impact strength with a gap | ISO 180/1A | -30 | KJ/㎡ | 8 |
| Thermal Property | ||||
| Thermal Property | Testing standards | Test conditions | Unit | Data |
| Non-burning-out Heat distortion temperature | ISO 75/A | 1.8MPa | ℃ | 75 |
| burning-out Heat distortion temperature | ISO 75/A | 1.8MPa | ℃ | 95 |
| Electrical Property | ||||
| Electrical Property | Testing standards | Data | Unit | |
| Bulk Resistance | IEC 60695-11-10 | HB | Ω | |
| Insulation strength 1.5mm | IEC 60695-11-10 | HB75 | kv/mm | |
| Flame Retardancy | ||||
| Flame Retardancy | Testing standards | Data | ||
| Fire rating full-color 1.5mm | UL94 | V-2 | ||
| Fire rating full-color 3.0mm | UL94 | V-2 | ||
| Injection molding | ||||
| Injection molding | Unit | Data | ||
| drying temperature | ℃ | 85 | ||
| drying time | H | 3～5 | ||
| Front measuring area Temperature | ℃ | 250～220 | ||
| Mid compression zone Temperature | ℃ | 250～220 | ||
| Third section feeding zone Temperature | ℃ | 220～200 | ||
| Optimal ejection temperature | ℃ | 230~240 | ||
| Maximum melting temperature | ℃ | 250 | ||
| mold temperature | ℃ | 50～70 | ||
| injection speed | Medium low speed | |||
| Back pressure | 5～10 | KG/c㎡ | ||
