Product Description:
High rigidity/high gloss/medium impact strength.
Home appliances/electronics/office product casings/copier casings/telephone casings/cosmetic containers... etc.
QIMEI POLYLAC ® ABS resin is a copolymer mainly composed of styrene (SM), acrylonitrile (AN), and butadiene (BD) as raw materials. ABS has extremely excellent mechanical properties, dimensional stability, processability, chemical resistance, and first-class appearance. These advantages make ABS resin an excellent engineering plastic. POLYLAC ® Made using cutting-edge technology from Chimei, known for its extremely low residual monomers. It has been widely used in the manufacturing of machinery, electronic parts, electrical and household appliances, automotive parts, medical products, food and drinking water containers, building materials, toys and sports equipment, and cosmetic containers. POLYLAC ® Complies with RoHS, REACH SVHC, UL, and multiple international standards for various applications.
Product Description:
High rigidity/high gloss/medium impact strength.
Home appliances/electronics/office product casings/copier casings/telephone casings/cosmetic containers... etc.
QIMEI POLYLAC ® ABS resin is a copolymer mainly composed of styrene (SM), acrylonitrile (AN), and butadiene (BD) as raw materials. ABS has extremely excellent mechanical properties, dimensional stability, processability, chemical resistance, and first-class appearance. These advantages make ABS resin an excellent engineering plastic. POLYLAC ® Made using cutting-edge technology from Chimei, known for its extremely low residual monomers. It has been widely used in the manufacturing of machinery, electronic parts, electrical and household appliances, automotive parts, medical products, food and drinking water containers, building materials, toys and sports equipment, and cosmetic containers. POLYLAC ® Complies with RoHS, REACH SVHC, UL, and multiple international standards for various applications.
| Material Technical Data Sheet | ||||
| ABS-04 PA-757 High GLOSS ABS | ||||
| characteristic | Application Area | |||
| Good surface | Electronic and Electrical Applications | |||
| Performance & dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| High temperature resistance | precise molding applications | |||
| dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| characteristic | Testing standards | Test conditions | Unit | Typical value |
| Physical Property | ||||
| proportion | ISO 1183 | 23℃ | g/cm³ | 1.05 |
| Mold Shrinkage | ISO 294-4 | % | 0.4~0.7 | |
| Melt Index | ISO 1133 | 220℃ X10KG | ml/10 min | 19 |
| Mechanical Property | ||||
| Mechanical Property | Testing standards | Test conditions | Unit | Data |
| tensile strength | ISO 527 | 50mm/min | mpa | 47 |
| Elongation rate | ISO 527 | 50mm/min | % | 45 |
| bending strength | ISO 178 | 2mm/min | MPA | 76 |
| Bending elastic modulus | ISO 178 | 2mm/min | GPA | 2.2 |
| IZOG impact strength with a gap |
ISO 180/1A |
23℃ |
KJ/㎡ |
19 |
| IZOG impact strength with a gap |
ISO 180/1A |
-30 | KJ/㎡ |
9 |
| Thermal Property | ||||
| Thermal Property | Testing standards | Test conditions | Unit | Data |
| Non-burning-out Heat distortion temperature | ISO 75/A | 1.8MPa | ℃ | 104 |
| burning-out Heat distortion temperature |
ISO 75/A |
1.8MPa |
℃ |
100 |
| Electrical Property | ||||
| Electrical Property |
Testing standards |
Data |
Unit | |
| Bulk Resistance |
IEC 60695-11-10 |
HB |
Ω | |
| Insulation strength 1.5mm |
IEC 60695-11-10 |
HB75 |
kv/mm | |
| Flame Retardancy | ||||
| Flame Retardancy |
Testing standards |
Data | ||
| Fire rating full-color 1.5mm |
UL94 |
V-2 | ||
| Fire rating full-color 3.0mm |
UL94 |
V-2 | ||
| Injection molding | ||||
| Injection molding | Unit | Data | ||
| drying temperature | ℃ | 80～85 | ||
| drying time | H | 2～4 | ||
| Front measuring area Temperature | ℃ | 230～190 | ||
| Mid compression zone Temperature | ℃ | 230～190 | ||
| Third section feeding zone Temperature | ℃ | 220～180 | ||
| Maximum melting temperature | ℃ | 240 | ||
| mold temperature | ℃ | 30～70 | ||
| injection speed | Medium low speed | |||
| Material Technical Data Sheet | ||||
| ABS-04 PA-757 High GLOSS ABS | ||||
| characteristic | Application Area | |||
| Good surface | Electronic and Electrical Applications | |||
| Performance & dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| High temperature resistance | precise molding applications | |||
| dimension stability | CD/DVD internal bracket | |||
| good mechanical properties | Internal structure of OA devices | |||
| high rigidity | Imaging device casing | |||
| Low Warpage | Computer plug | |||
| characteristic | Testing standards | Test conditions | Unit | Typical value |
| Physical Property | ||||
| proportion | ISO 1183 | 23℃ | g/cm³ | 1.05 |
| Mold Shrinkage | ISO 294-4 | % | 0.4~0.7 | |
| Melt Index | ISO 1133 | 220℃ X10KG | ml/10 min | 19 |
| Mechanical Property | ||||
| Mechanical Property | Testing standards | Test conditions | Unit | Data |
| tensile strength | ISO 527 | 50mm/min | mpa | 47 |
| Elongation rate | ISO 527 | 50mm/min | % | 45 |
| bending strength | ISO 178 | 2mm/min | MPA | 76 |
| Bending elastic modulus | ISO 178 | 2mm/min | GPA | 2.2 |
| IZOG impact strength with a gap |
ISO 180/1A |
23℃ |
KJ/㎡ |
19 |
| IZOG impact strength with a gap |
ISO 180/1A |
-30 | KJ/㎡ |
9 |
| Thermal Property | ||||
| Thermal Property | Testing standards | Test conditions | Unit | Data |
| Non-burning-out Heat distortion temperature | ISO 75/A | 1.8MPa | ℃ | 104 |
| burning-out Heat distortion temperature |
ISO 75/A |
1.8MPa |
℃ |
100 |
| Electrical Property | ||||
| Electrical Property |
Testing standards |
Data |
Unit | |
| Bulk Resistance |
IEC 60695-11-10 |
HB |
Ω | |
| Insulation strength 1.5mm |
IEC 60695-11-10 |
HB75 |
kv/mm | |
| Flame Retardancy | ||||
| Flame Retardancy |
Testing standards |
Data | ||
| Fire rating full-color 1.5mm |
UL94 |
V-2 | ||
| Fire rating full-color 3.0mm |
UL94 |
V-2 | ||
| Injection molding | ||||
| Injection molding | Unit | Data | ||
| drying temperature | ℃ | 80～85 | ||
| drying time | H | 2～4 | ||
| Front measuring area Temperature | ℃ | 230～190 | ||
| Mid compression zone Temperature | ℃ | 230～190 | ||
| Third section feeding zone Temperature | ℃ | 220～180 | ||
| Maximum melting temperature | ℃ | 240 | ||
| mold temperature | ℃ | 30～70 | ||
| injection speed | Medium low speed | |||
